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Roll Size Single Shiny S - HTE ED Foil For PCB Made Of Red Copper

Civen Metal Material(Shanghai) Co.,Ltd
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Roll Size Single Shiny S - HTE ED Foil For PCB Made Of Red Copper

Brand Name : Civen
Certification : SVHC
Place of Origin : SHANGHAI,CHINA
MOQ : 1MT
Price : Negotiation
Payment Terms : T/T
Delivery Time : 15~20 days
Model Number : MGP-ED 081821
Packaging Details : wooden case with paper inner core for ecporting
Alloy Number : C11000
Material : Red Copper
Shape : Roll Size
Thickness : 1/4OZ~20OZ(9μm~70μm)
Width : 550mm~1295mm
Density : 8.9g/cm3
Application : PCB
HS Code : 7410110000
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Single Shiny S - HTE ED Copper Foil For PCB Made Of Red Copper


Description:


CCL/PCB electrolytic copper foil are classified as :Standard electrolytic copper foil(STD),High-temperture elongation of the copper foil( HTE) ,ultra-low contour copper foil(VLP), flexible copper foil(FCF),inversion of opper foil(RTF).Ordinary thickness of the ED copper foils are 6 microns and 8 microns ,12 microns ,18 microns,35microns ,105 microns, 400 microns,etc. The maximum width of the ED copper foil iw 1370mm(53.93inch),.Also we can do special process according to customer requirements .


Specification:


Classification

Unit

1/4OZ

(9μm)

1/3OZ

(12μm)

J OZ

(15μm)

1/2OZ

(18μm)

1OZ

(35μm)

2OZ

(70μm)

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

127±4

153±5

283±5

585±10

Tensile Strength

R.T.(25℃)

Kg/mm2

≥28

≥30

H.T.(180℃)

≥15

Elongation

R.T.(25℃)

%

≥4.0

≥5.0

≥6.0

≥10

H.T.(180℃)

≥4.0

≥5.0

≥6.0

Roughness

Shiny(Ra)

μm

≤0.4

Matte(Rz)

≤5.0

≤6.0

≤7.0

≤7.0

≤9.0

≤14

Peel Strength

R.T.(23℃)

Kg/cm

≥1.0

≥1.2

≥1.2

≥1.3

≥1.8

≥2.0

Degraded rate of HCΦ(18%-1hr/25℃)

%

≤5.0

Change of color(E-1.0hr/190℃)

%

Good

Solder Floating 290℃

Sec.

≥20

Pinhole

EA

Zero

Preperg

----

FR-4


Metallographic:



Product Tags:

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Roll Size Single Shiny S - HTE ED Foil For PCB Made Of Red Copper Images

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